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Piezoelectric ceramic wafers for ultrasonic polishing machine

Pbulish:admin  time:2008年03Month21Day

 

型号及规格

外型尺寸(mm)
直径×厚度

主要技术特征

fr(MHz)

Kr

HF-28/2MC

φ24/φ8× 5

64

0.43

HF-25/1MC

φ30/φ10×5

50

0.43

HF-20/1MC

φ35/φ16×5

0

0.42